February 18, 2026
We are proud to share that CoolSem Technologies has been featured in Compound Semiconductor Magazine with a deep dive into our thermal management technology.
🔗 Read the full article on Compound Semiconductore here
In “A universal solution for chip heating”, the article explores how advanced thermal engineering is becoming a decisive factor in next-generation semiconductor performance, and how CoolSem’s approach enables more efficient heat extraction without compromising device integrity.
As power densities continue to rise across photonics and semiconductor applications, effective thermal management is no longer optional, it is foundational to reliability, lifetime, and performance.
🙏A sincere thank you to Richard Stevenson of Compound Semiconductor for the thoughtful coverage, for the insightful discussion and clear presentation of our technology.
We appreciate the opportunity to contribute to the broader conversation on enabling higher performance chips through smart and disruptive thermal design.
Compound Semiconductor magazine - Article Abstract
At times, our industry appears a disparate entity. The high-power GaAs lasers diodes that cut and weld metals operate in a different sphere from their InP cousins that underpin the internet – and both of these emitters occupy different domains from the RF devices deployed in defence, and the wide bandgap diodes and transistors that are improving the efficiency of power delivery.
But there are common threads running through these various classes of compound semiconductor devices. One is that they are united by epitaxial growth, with gains on this front having far-reaching ramifications. And another, of high importance but not discussed as much, is that the performance of all these devices derives substantial benefits from better thermal management. Gains include higher output powers, greater efficiencies, and longer lifetimes.
A new, exciting and universal solution to this critical thermal management issue is now being pioneered by Dutch start-up CoolSem. It has just secured a pre-seed financing round that will support the commercialisation of its chip-cooling technology, involving removal of a substrate, which is replaced by a composite structure with a vastly superior thermal conductivity.
The trailblazer of this technology is CoolSem CEO and CTO, André van Geelen. Back in the early 1990s, during his time as a PhD student at Radboud University, he developed a key element of the start-up’s core technology – wafer-scale removal of a substrate from its epilayers via epitaxial lift-off, a proven process already in use for the formation of large, flexible III-V solar cells. [...]
🔗 The full article on Compound Semiconductor
