January 19, 2026

CoolSem secures €500,000 in additional early-stage funding

We are excited to share that CoolSem Technologies has raised an additional €500,000 in early-stage funding from the Brabant Startup Fonds BV (BSF) and the Rabobank Innovation Loan (RIL) program.

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A great milestone as we continue to grow our deep-tech journey

This support helps us advance our wafer-level thermal management technology — reducing thermal resistance and mechanical stress in advanced semiconductor and photonic devices. With our WaLTIS multilayer stack, we replace the conventional substrate with an engineered one that enhances heat flow, mechanical stability, and reliability. This platform serves as a foundation for applications across RF, Opto, and Power domains.

The funding allows us to accelerate our Proof-of-Concept work and move faster toward first validation results. It also strengthens our ability to collaborate with partners, expand our development efforts, and prepares the next steps in bringing our technology into real-world applications.

“We’re proud to support CoolSem as they bring meaningful semiconductor innovation to the Brabant region. Their early progress shows strong potential for impact.” - Gerard Spanbroek, Brabant Startup Fonds BV
“Rabobank is pleased to support CoolSem through our Innovation Loan program. Their wafer-level approach to thermal management directly contributes to reducing energy consumption — key to a more sustainable digital future!” - Michel Ziekman, Rabobank

We greatly appreciate the support from the Brabant Startup Fund and Rabobank. Exciting steps lie ahead.

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