July 8, 2026
We are proud to share that CoolSem Technologies has been featured in IO+ - Innovation Origins - Magazine with an in-depth article on CoolSem Technologies and our wafer-level approach to thermal management.
🔗 Read the full article on IO+ here
The article explores why heat has become one of the biggest limiting factors in next-generation semiconductors, how wafer-level thermal engineering can unlock higher performance and reliability, why manufacturability is essential for bringing these innovations to market and the strength of the Dutch deep-tech ecosystem that helps transform breakthrough research into scalable technology.
🙏 A sincere thank you to the journalist Mauro Mereu & IO+ Magazine.
